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通过改变裂纹的倾角、宽度和深度参数,模拟了赫兹型裂纹在不同参数下对光场调制能力的不同.模拟发现,倾斜角度为20.9到45之间的裂纹危害最大,倾角大于45小于48.2的裂纹危害也十分大,而倾斜角度为45时的裂纹危害最小.对于30倾角的赫兹型裂纹,一定范围内,赫兹型裂纹深度的增加会导致其光场调制增强能力呈二次方关系增加,但宽度的增加不会使其光场调制增强作用增加.裂纹深度和宽度的增加可以用来近似裂纹的演化过程,所以裂纹的扩展导致了其光场调制能力的增加,进而导致损伤增长速率的加快,这和e指数损伤增长规律相符.
By varying the dip, width and depth parameters of the crack, the different modulation capability of the Hertzian crack under different parameters was simulated. The simulation results showed that the crack with the angle between 20.9 and 45 was the most damaging and the dip angle was more than 45 and less than 48.2 The crack damage is also very large, and the crack damage is the least when the tilt angle is 45. For a Hertzian crack with a dip angle of 30, the increase of Hertzian crack depth causes the quadratic relationship of its light field modulation enhancement ability, However, the increase of width does not increase the enhancement of light field modulation.The increase of crack depth and width can be used to approximate the evolution of crack, so the propagation of crack leads to the increase of light field modulation ability, which leads to the increase of damage growth rate Speed up, which is consistent with the law of damage growth e index.