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粘接技术正在我国广泛开展,但对粘接技术的理论仍是当前一个探讨的课题。为了有助于理论指导科研与生产,本刊特约华南工学院材料科学研究所潘慧铭副教授从本期开始,对近代粘合理论的研究,主要是粘合体系界面行为的研究。重点内容有:1.界面的粘附(吸附)作用;2.界面的配位作用与化学反应;3.界面的扩散作用;4.界面的静电作用、机械作用和弱界面层;5.粘合结构的破坏过程等,进行较系统的介绍。以使读者对当今的粘接理论研究有一了介,并从中得以借鉴和参考。
Bonding technology is widely carried out in our country, but the theory of bonding technology is still a subject of discussion. In order to help the theory to guide the research and production, this article specializes in South China Institute of Materials Science Pan Hui-ming, associate professor from the beginning of this issue, the study of modern bonding theory, mainly bonding system interface behavior. The key contents are as follows: 1. The adhesion (adsorption) effect of the interface; 2. The coordinating action and the chemical reaction of the interface; 3. The diffusion of the interface; 4. The electrostatic interaction of the interface, the mechanical action and the weak interface layer; The destruction of the structure of the process, a more systematic presentation. In order to make the readers have an introduction to the research of bonding theory nowadays and learn from it.