论文部分内容阅读
本文基于体视学理论,借助PTR-1100型接合强度测试仪、DUH-211S超显微动态硬度计和扫描电镜设备,对Sn-5Sb-xnano Cu/Cu焊点微观组织及力学性能进行了分析对比。研究结果表明:添加纳米Cu颗粒使焊点润湿性能下降。回流焊和时效后,随着纳米Cu颗粒含量的增加,界面金属间化合物(IMC)的厚度均下降,表明纳米Cu颗粒抑制了界面IMC的增厚。对焊点进行了显微硬度测试,当纳米Cu含量为0.1mass%时,硬度相比较于未添加纳米Cu提高27.4%,达到最大值。借助SEM观察焊点剪切断口形貌,发现随着纳米Cu的添加,剪切断裂方式逐渐由韧性断裂向脆性断裂过渡。
Based on the theory of stereo vision, the microstructure and mechanical properties of Sn-5Sb-xnano Cu / Cu solder joint were analyzed by PTR-1100 bonding strength tester, DUH-211S ultra-micro dynamic hardness tester and scanning electron microscope Compared. The results show that the wettability of solder joints is decreased by adding nano-Cu particles. After reflow and aging, the thickness of the interface intermetallic compound (IMC) decreased with the increase of the content of nano-Cu particles, indicating that the nano-Cu particles inhibited the thickening of the interface IMC. The microhardness test of the solder joint was carried out. When the nano Cu content was 0.1mass%, the hardness was increased by 27.4% compared with that of the non-added nano Cu, reaching the maximum value. With SEM observation of the fracture morphology of the solder joints, it is found that the shear fracture mode gradually transitions from ductile fracture to brittle fracture with the addition of nano-Cu.