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随着各种表面安装元器件的大量问世,一项崭新的印制板组装技术——表面安装技术正在逐渐代替传统的印制板组装方法。它的突出优点是:安装密度大、生产率高、组装质量好,而且由于降低了各种寄生参数,某些电性能参数也相应提高。本文对各种有引线或无引线的表面安装元器件的结构与电性能特点作了简单介绍,并着重详述了表面安装印制组件的结构及其制造工艺。对表面安装印制组件的制造,有两种工艺方法:粘合—波峰焊法;焊锡膏—热溶焊法。本文详细地阐述了这两种方法,并对每种方法的关键所在作了介绍。
With the advent of a large variety of surface mount components, a new PCB assembly technology, surface mount technology, is gradually replacing traditional PCB assembly methods. Its outstanding advantages are: mounting density, high productivity, good assembly quality, and due to reduced parasitic parameters, some of the electrical parameters also increased accordingly. This paper gives a brief introduction of the structure and electrical characteristics of various lead or leadless surface mount components and details the structure and manufacturing process of surface mount components. There are two ways to manufacture surface mount components: bonding - wave soldering; solder paste - hot soldering. This article elaborates both of these approaches and describes the key aspects of each approach.