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采用化学镀法在玻璃微珠表面先沉积镍镀层、再化学镀银,制备了Ag/Ni/玻璃微珠复合粉体。讨论了活化剂氯化钯和主盐硫酸镍的浓度、镀液pH对玻璃微珠表面化学镀镍层表面形貌的影响,得出了较佳的镀镍工艺条件:PdCl20.3g/L,NiSO4·6H2O30g/L,pH11。在此基础上化学镀银,采用扫描电镜和能谱分析对Ag/Ni/玻璃微珠结构进行了表征,测试了粉体的体积电阻率、介电常数、磁导率和磁性能。结果表明,镀镍玻璃微珠表面成功包覆一层银,Ag/Ni/玻璃微珠复合粉体的体积电阻率由Ni/玻璃微珠的2.28×104·cm降低至7.64×105·cm,导电性、介电损耗和磁损耗均提高;Ag/Ni/玻璃微珠粉体的饱和磁化强度为27.2emu/g,可以作为一种宽频电磁屏蔽材料的填料。
The electroless plating method was used to deposit the nickel coating on the surface of the glass beads and then electroless silver plating to prepare the Ag / Ni / glass bead composite powders. The effects of the concentrations of activator palladium chloride and main salt of nickel sulfate on the surface morphology of electroless nickel plating on the surface of glass microbeads were discussed. The optimum conditions of nickel plating were obtained: PdCl20.3g / L, NiSO4 · 6H2O30g / L, pH11. Based on this, Ag / Ni / glass microstructure was characterized by scanning electron microscopy (SEM) and energy dispersive spectroscopy. The volume resistivity, dielectric constant, magnetic permeability and magnetic properties of the powders were tested. The results show that the volume resistivity of Ag / Ni / glass microbead is reduced from 2.28 × 104 · cm to 7.64 × 105 · cm, Conductivity, dielectric loss and magnetic loss increase. The saturation magnetization of Ag / Ni / glass bead powder is 27.2 emu / g, which can be used as filler of a wideband electromagnetic shielding material.