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用离子镀在W18Cr4V高速钢基材上制备了低硼含量的Ti-B-N薄膜。膜层厚度为2～5.5μm,显微硬度平均值为4200kg/mm~2(15g载荷),膜-基界面结合强度大于120kg/mm~2,对金刚石表面的摩擦系数为0.086～0.14(1000g载荷)。X射线与电子衍射表明:膜层主要由TiN(面心立方)、TiB(简单正交)、Ti-B-N(简单六方)三相组成,其中TiN含量最高,膜层表现出择优取向。用扫描电镜与透射电镜观察了膜层的表面与界面显微形貌,用离子探针分析了膜层的化学组成及其深度分布。
A low boron content Ti-B-N thin film was prepared by ion plating on W18Cr4V high speed steel substrate. The film thickness of 2 ~ 5.5μm, the average microhardness of 4200kg / mm ~ 2 (15g load), the film - based interface bonding strength greater than 120kg / mm ~ 2, the friction coefficient of the diamond surface 0.086 ~ 0.14 Load). The results of X-ray diffraction and electron diffraction show that the films mainly consist of TiN (face centered cubic), TiB (simple orthogonal) and Ti-B-N (simple hexagonal) three phases with the highest content of TiN and the preferred orientation of the film. The surface and interface morphology of the film were observed by SEM and TEM. The chemical composition and depth distribution of the film were analyzed by ion probe.