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采用热等静压的方法制备了SiCp／Cu电子封装复合材料．材料热膨胀系数（CTE）和导热率的测定表明，增加SiC体积分数和减小SiC颗粒的尺寸有利于降低CTE值；SIC质量分数超过26％这一临界值后，材料导热率会明显下降．减小残余应力有利于降低材料的CTE值．
The SiCp / Cu electronic packaging composites were prepared by hot isostatic pressing. The CTE and thermal conductivity measurements show that increasing the volume fraction of SiC and reducing the size of the SiC particles are effective in reducing the CTE. After the critical mass fraction of SIC exceeds 26%, the thermal conductivity of the material decreases significantly. Reduce the residual stress helps to reduce the CTE value of the material.