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镀金在电子工业中的应用之所以如此广泛,是由于镀金层具有很多优越特性。但也存在一个致命的弱点,即金镀层孔隙的存在,将引起外界腐蚀介质穿透孔隙而腐蚀基体或中间镀层。当其腐蚀产物从孔隙散布在金层表面上成大小不一的黑点时,它的许多独特优点将完全丧失,其严重后果表现在: 1.破坏镀层的装饰外观; 2.表面电阻增大,接插件接触不良,微波损耗增加; 3.表面焊接性降低或焊不上; 4.在孔隙部位由于横向侧腐蚀而引起镀层鼓泡、起皮甚至脱落; 5.破坏表面光洁度; 最后,导致电子设备可靠性稳定性降
The reason why gold plating is so widely used in the electronics industry is that the gold plating has many advantages. But there is also a fatal weakness, that the existence of gold-plated pores, will cause the external corrosive medium to penetrate the pores and corrode the substrate or intermediate plating. Many of its unique advantages are completely lost when its products of corrosion are scattered from the pores into black spots of varying sizes on the surface of the gold layer, with the serious consequences of: 1. Disrupting the decorative appearance of the coating; 2. Increasing the surface resistance , Poor contact with the connector, microwave loss increased; 3. The surface of the weldability is reduced or welding is not; 4. In the pore area due to the lateral side of the corrosion caused by bubbling plating, peeling or even off; 5. Destroy the surface finish; Finally, Electronic Equipment Reliability Stability Decreased