diamonds相关论文
Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HP
该文从挂篮荷载计算、施工流程、支座及临时固结施工、挂篮安装及试验、合拢段施工、模板制作安装、钢筋安装、混凝土的浇筑及养生......
Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composit
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature(HPHT) infil......
Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle si
The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied.The composites were prepar......
Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with var
The interfacial thermal conductance (ITC) and thermal conductivity (TC) of diamond/Al composites with various coatings w......
Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HP
Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature (HPHT) sintering with the aim......
