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以铜(Cu)粉为导热填料,采用模压法制备了聚醚醚酮(PEEK)/Cu导热复合材料,并研究了铜粉粒径对PEEK/Cu导热复合材料导热性能、力学性能及结晶性能的影响。结果表明:随着Cu粉粒径的增大,PEEK/Cu导热复合材料的力学性能逐渐下降;当Cu粉粒用量为30%、粒径为10μm时导热复合材料的导热系数达到最佳值0.396 W/(m·K),相比于纯PEEK提高了67.80%;熔融焓与结晶度随着Cu粉粒径的增大而逐渐减小,因而PEEK/Cu导热复合材料的结晶性能降低。
PEEK / Cu thermal conductive composites were prepared by molding with copper (Cu) powder as thermal conductive filler. The effects of copper particle size on the thermal conductivity, mechanical properties and crystallinity of PEEK / Cu thermal conductive composites Impact. The results show that the mechanical properties of PEEK / Cu composites decrease with the increase of Cu particle size. When the Cu powder content is 30% and the particle size is 10μm, the thermal conductivity of the composites reaches 0.396 W / (m · K), which is 67.80% higher than that of pure PEEK. The enthalpy and degree of crystallinity of PEEK / Cu composites decreased with the increase of Cu particle size.