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对Ti-Ag-Cu法99％Al_2O_3瓷与无氧铜封接的样品,采用金相-电子显微镜、X射线和电子探针分析方法,确定了封接区域的全部物相。封接温度在800～860℃范围,封接区域的物相,除Ag和Cu外,还有: 1.过渡层为一种约9%的Cu替代Ti的Cu_2(Ti,Cu)_4O相,它的点阵常数a=11.30; 2.CU_3Ti相晶形呈“球”状和“长条”状两种(860℃该相消失); 3.呈“小点”状的Cu_2(Ti,Cu)_4O相; 4.Ti和Ag固溶到Cu中的富Cu固溶相与晶粒细小的Cu_7Ti_2相(得到了该相的X射线衍射的d值和I/I_0值)组成的“网状物”; 5.扩散层。对Ti-Ag-Cu法99%Al_2O_3瓷与无氧铜封接,认为有如下反应过程: 当封接温度为780℃时(Ag-Cu焊料已熔化),活性钛迅速与液态铜反应,生成Cu_3Ti;接着CU_3Ti和从陶瓷界面放出的氧反应,在界面上形成过渡层Cu_2(Ti,Cu)_4O。在封接温度由780℃逐渐升至860℃期间,Cu_3Ti和氧的反应继续进行。因而,Cu_3Ti的量不断减少(860℃时消失),而过渡层Cu_2(Ti,Cu)_4O的量则大致成直线增加。由于存在上述这些反应过程,从而完成陶瓷与无氧铜的牢固封接。我们认为:过渡层Cu_2(Ti,Cu)_4O中的氧来源于陶瓷中的吸附氧和陶瓷内气相中的氧。
The samples of 99% Al 2 O 3 ceramic and oxygen-free copper sealed by Ti-Ag-Cu method were determined by metallographic-electron microscope, X-ray and electron probe analysis. The sealing temperature ranged from 800 ℃ to 860 ℃. The phases of the sealing zone, besides Ag and Cu, were as follows: 1. The transitional layer was a Cu_2 (Ti, Cu) _4O phase that replaced Cu by about 9% Its lattice constant a = 11.30; 2.CU_3Ti phase shape was “spherical” and “long” shape (860 ℃ phase disappear); 3. The “dot” like Cu_2 (Ti, Cu) _4O phase; 4.Ti and Ag solid solution to Cu in Cu-rich solid solution phase and fine grain Cu_7Ti_2 phase (obtained by the X-ray diffraction of the d value and I / I_0 value) consisting of “mesh ”; 5. Diffusion layer. The 99% Al_2O_3 ceramic was sealed with oxygen-free copper by Ti-Ag-Cu method. The reaction process was as follows: When the sealing temperature was 780 ℃ (Ag-Cu solder had melted), the active titanium reacted rapidly with liquid copper to form Cu_3Ti. Then Cu_3Ti reacts with the oxygen released from the ceramic interface to form a transition layer Cu_2 (Ti, Cu) _4O at the interface. During the gradual increase of the sealing temperature from 780 ℃ to 860 ℃, the reaction of Cu_3Ti with oxygen continued. Therefore, the amount of Cu_3Ti decreased continuously (disappear at 860 ℃), while the amount of transitional Cu_2 (Ti, Cu) __O increased linearly. Due to the existence of these reaction processes, thus completing the ceramic and oxygen-free copper firm seal. In our opinion, the oxygen in transitional Cu_2 (Ti, Cu) _4O originates from the adsorbed oxygen in the ceramic and the oxygen in the gas phase in the ceramic.