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通过集束拉拔技术获得了高强度高电导Cu-Nb微观复合材料,采用SEM及EDS观察分析了4次复合过程中内部Nb芯丝和Cu层的微观形貌变化,Cu/Nb界面的互扩散行为;对不同复合条件下的挤压、拉拔样品,通过XRD测试,表征了芯丝和基体的晶体取向的演变规律;通过HRTEM和反傅里叶变换研究了Cu/Nb的界面结构和晶体学位向关系。研究表明,在极塑性变形条件下,Cu/Nb界面在3次复合出现明显扩散,Cu、Nb逐渐形成丝织构取向,界面存在典型的(111)_(Cu)//(110)_(Nb)取向关系,晶面夹角为18.7°,每6个(111)Cu晶面出现1个晶面错配。
High-strength and high-conductivity Cu-Nb micro-composite was obtained by bundling drawing technology. The microstructure of the inner Nb core wire and Cu layer were observed by SEM and EDS. The mutual diffusion of Cu / Nb interface Behavior of the core wire and matrix were characterized by XRD and XRD. The interface structure and crystal structure of Cu / Nb were studied by HRTEM and inverse Fourier transform Degree to relationship. The results show that the Cu / Nb interface is obviously diffused in the third recombination under the condition of the maximum plastic deformation, while the Cu and Nb gradually form the silk texture orientation. The interface has the typical (111) _ (Cu) // (110) _ Nb) orientation with a crystal plane angle of 18.7 °. One crystal plane mismatch occurs every 6 (111) Cu planes.