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采用经硅烷偶联剂KH-560表面改性的纳米银粉作为填料,环氧树脂为基体在180℃固化得到银导电胶。借助透射电子显微镜(TEM)、红外光谱(FTIR)、差示扫描量热法(DSC)等测试手段,对改性后纳米银粉和导电胶进行了表征。研究了银粉含量、固化时间对导电胶性能的影响。结果表明:KH-560改性后的纳米银粉平均粒径为20 nm,分散均匀;KH-560以化学键合的方式吸附在纳米银颗粒的表面。银粉含量、固化时间等均会影响导电胶的性能。当银粉含量为55%,固化时间为15 min时,导电胶的体积电阻率达最小值为2.5×10-3Ω·cm。与未做任何表面处理的纳米银粉填充的导电胶相比, KH-560改性后纳米银粉所得导电胶的电导率提高了3-5倍。
Nano silver powder modified by silane coupling agent KH-560 was used as filler, and epoxy resin was cured at 180 ℃ to obtain silver conductive adhesive. The modified nano-silver powder and conductive paste were characterized by transmission electron microscopy (TEM), infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects of silver content and curing time on the properties of conductive adhesive were studied. The results showed that the average particle diameter of nano-silver powder modified by KH-560 was 20 nm and dispersed uniformly; KH-560 was chemically bonded to the surface of nano-silver particles. Silver content, curing time will affect the performance of conductive plastic. When the silver content is 55% and the curing time is 15 min, the volume resistivity of the conductive adhesive reaches a minimum of 2.5 × 10 -3 Ω · cm. Compared with the conductive paste filled with nano-silver powder without any surface treatment, the conductivity of the conductive paste obtained from the nano-silver powder modified by KH-560 has been increased by 3-5 times.