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“未来的FPGA,将会采用创新的迭堆式封装(SIP),即在一个封装里放多个裸片的技术,到那时,FPGA将成为一个标准的、虚拟的SoC平台来应用。”
“Future FPGAs will adopt an innovative stack-in-package (SIP) technology that puts multiple die in a single package, at which point the FPGA will become a standard, virtual SoC platform. ”