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Bi基钎料具有较低固液温度的优点,但其力学性能较差。本文通过在BiSbSn钎料中加入微量元素Ni来改善钎料合金的微观组织结构,从而提高钎料合金的力学性能。结果表明,当Ni含量(wNi)为1%时,钎料的抗拉强度最大,约为44.26 MPa。当wNi小于3%时,钎料的剪切强度逐渐增大;当wNi大于3%后,钎料的剪切强度逐渐下降。综合来看,Bi5Sb8SnxNi钎料的综合性能以wNi为1%～3%为最佳。
Bi-based solder has the advantages of lower solid-liquid temperature, but its mechanical properties are poor. In this paper, by adding microelement Ni to BiSbSn solder to improve the microstructure of the solder alloy, thereby improving the mechanical properties of the solder alloy. The results show that when the Ni content (wNi) is 1%, the tensile strength of the brazing filler metal is the highest, about 44.26 MPa. When the wNi is less than 3%, the shear strength of the solder increases gradually. When wNi is greater than 3%, the shear strength of the solder decreases gradually. Taken together, the overall performance of Bi5Sb8SnxNi solder with wNi of 1% to 3% is the best.