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MCM－D是近年来发展起来的高密度多芯片组装技术，其制做工艺同IC工艺相兼容，因此在IC生产厂家发展得很快。本文主要介绍用IC加工工艺和设备制备MCM－D技术以及MCM—D的芯片安装技术。
MCM-D is developed in recent years, high-density multi-chip assembly technology, its manufacturing process compatible with the IC process, so the IC manufacturers have developed rapidly. This article describes the use of IC processing technology and equipment to prepare MCM-D technology and MCM-D chip mounting technology.