论文部分内容阅读
新兴的 3D 互联技术以及高产量的 MEMS 应用需要成本低廉以及高产量的深层反应离子刻蚀系统。最优化的 Alcatel 深层反应离子刻蚀系统可以同时满足工艺以及硬件生产性能的高要求。这些都已经在典型刻蚀工艺上进行了研究, 包括斜面刻蚀、堆叠时的 CMOS 刻蚀侧壁角度、3D 高精度惯性传感器的良好控制的形貌、大面积刻蚀的打印机喷头和硅麦克风应用。优化的工艺参数意味着在刻蚀率, 刻蚀的深宽比, notch free 的工艺, 光滑度以及高精度控制各方面的显著提高。Alcatel AMS 200 “I-Productivity”DRIE 机台用于高产量的工艺同时也确保了生产参数如整机效率的提高以及使用成本的降低, 这是通过机台的无可替代的硬件以及工艺方案实现的。
Emerging 3D interconnect technologies, as well as high volume MEMS applications, require low cost and high volume deep reactive ion etching systems. The optimized Alcatel deep reactive ion etching system meets the high demands of both process and hardware production. These have all been investigated on typical etch processes including bevel etch, CMOS etched side-wall angle for stacking, well-controlled topography of 3D high-precision inertial sensors, large-area etched printer heads and silicon microphones application. Optimized process parameters mean significant improvements in etch rate, aspect ratio of etching, notch free process, smoothness, and high precision control. The Alcatel AMS 200 “I-Productivity” DRIE machine is used for high-volume processes while ensuring the production parameters such as machine efficiency and cost reduction are achieved through the machine’s irreplaceable hardware and process options of.