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创建一种光刻胶离心式旋涂过程中基于流体力学分析的凸面胶厚分布及胶厚均匀性模型,根据曲面流体运动方程以及凸面基片的面型特征得到了凸面恒速甩胶过程中胶层厚度的分布公式,结合凸面流体层流条件和牛顿流体的质量连续方程推导出胶厚分布与胶液类型、初始胶液粘度和密度、转速、基片几何尺寸以及甩胶时间等参数的关系式,利用光谱椭偏仪和台阶仪所测得的结果对该模型进行了验证,两者有较好的吻合,同时建立了胶厚均匀性与甩胶转速、甩胶时间的关系式,该模型可跟踪、监控和改进预光刻过程中凸面胶层的均匀性,以便改善最后的光刻线条质量。
A model of convex adhesive thickness distribution and thickness uniformity based on fluid mechanics analysis was established during the spin-coating process of photoresist. According to the equation of surface fluid motion and the surface features of the convex substrate, According to the distribution formula of the thickness of the glue layer and the parameters of the glue thickness distribution, the glue type, the viscosity and density of the initial glue, the rotational speed, the geometrical dimensions of the substrate and the time of the glue rejection, a combination of the laminar flow of the convex fluid and the continuous mass equation of Newtonian fluid The model was verified by the results of spectroscopic ellipsometry and stepmeter. The two models are in good agreement with each other. At the same time, the relationship between glue thickness uniformity and spin-off speed, The model tracks, monitors, and improves the uniformity of the cap layer during pre-lithography to improve the quality of the final lithography line.