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电子、电气工业中用导电胶粘剂,多以有机物为主粘料,将在空气中性能稳定的贵金属微细粒子分散其中而成。其导电机理与共晶合金、焊接均不相同。它是靠有机物(多为环氧树脂)固化形成粘接力,靠金属微粒子导热、导电。目前所用的导电胶,其粘接强度相当于金属焊料结合强度的70%左右
Electronic and electrical industries with conductive adhesives, and more organic-based adhesive, will be stable in the air of precious metals and fine particles dispersed therein. Its conductive mechanism and eutectic alloy, welding are not the same. It is based on organic matter (mostly epoxy resin) curing adhesive, metal particles by the thermal conductivity, conductive. Currently used conductive adhesive, the bonding strength of the metal solder bonding strength equivalent to about 70%