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研究比较了不同金属导电浆料、基片等厚膜材料的微波特性,发现通过改进厚膜工艺可使这种材料的应用领域大大扩展,并可推至微波频率下工作。引入厚膜腐蚀新工艺制得边缘齐整的、分辨率达25μm的厚膜精细线条及间隙。应用计算机辅助设计(CAD)技术及厚膜新工艺,设计制作了一种微波宽带放太器,其频带为3～7GHz,增益10±1dB,噪声小于5.7dB。另外还设计制作了性能优良的厚膜微波带通滤波器(中心频率7.7GHz)和3-dBLange耦合器,(中心频率为6GHz)。这些电路、元件用传统厚膜工艺是无法实现的。
The microwave characteristics of different metallic conductive pastes, substrates and other thick film materials were compared and studied. It was found that the application of this material could be greatly expanded by improving the thick film process and could be pushed to microwave frequencies. The introduction of thick film etching new technology to get a smooth edge, the resolution of 25μm thick film fine lines and gaps. A kind of microwave broadband AP is designed and manufactured with the aid of computer aided design (CAD) technology and thick film technology. Its frequency band is 3 ~ 7GHz, the gain is 10 ± 1dB and the noise is less than 5.7dB. In addition, a thick film microwave bandpass filter (center frequency of 7.7GHz) and 3-dBLange coupler (center frequency of 6GHz) are also designed and manufactured. These circuits, components, the traditional thick-film process can not be achieved.