论文部分内容阅读
虽然微电子学的封装相当于薄膜或混合器件成本的一个重要部分,但与半导体或薄膜材料工艺发展相比,它没有得到相应的发展。本文的目的是对在集成电路、薄膜系统和混合薄膜系统中普遍应用着的一些典型管壳进行讨论。一般估计,在每个成品的器件中,材料成本的50～80％用于管壳本身。显然,这是一个极其重要的范围。因此,无疑应集中全力对待它。图1示出一些大量生产的有使用价值的典型管壳。可以这样说,有用的管壳设计大概都投入了生产。
Although microelectronics packages represent an important part of the cost of thin-film or hybrid devices, they have not been developed as compared to the development of semiconductor or thin-film materials. The purpose of this article is to discuss some of the typical package cases commonly used in integrated circuits, thin film systems and hybrid thin film systems. It is generally estimated that 50-80% of the material cost per finished product is for the shell itself. Obviously, this is an extremely important area. Therefore it is undoubtedly a matter of focusing on it. Figure 1 shows some of the most widely used, cost-effective packages. It can be said that useful tube shell design are probably put into production.