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随着微电子工业的快速发展,为了提高大规模集成电路中芯片间的传输速度以满足高集成化的要求,需要层间绝缘材料具有较低的介电常数。聚酰亚胺已被广泛用于大规模集成电路的层间绝缘材料,降低其介电常数的研究在近年来受到了广泛关注。当采用化学方法降低介电常数时,调控聚酰亚胺的分子结构是基础;在聚酰亚胺中构建多孔结构则是进一步降低介电常数的有效手段。本文从调控分子结构和构建多孔结构的角度出发,综述了化学法制备低介电常数聚酰亚胺的研究进展,并对低介电常数聚酰亚胺的研究前景进行了展望。
With the rapid development of the microelectronics industry, in order to increase the transmission speed between chips in a large-scale integrated circuit to meet the requirements of high integration, the interlayer insulating material needs to have a lower dielectric constant. Polyimide has been widely used as an interlayer insulating material in large-scale integrated circuits. Research on reducing its dielectric constant has drawn wide attention in recent years. When the chemical method is used to reduce the dielectric constant, the molecular structure of the polyimide is controlled; constructing the porous structure in the polyimide is an effective method to further reduce the dielectric constant. In this paper, we reviewed the recent progress in the preparation of low dielectric constant polyimides from the perspective of molecular structure control and the construction of porous structures. We also prospected the research prospects of low dielectric constant polyimides.