几乎所有的现代设备都需要一块电路板来整合一块或多块芯片,以及额外所需的电子元件。由此产生了能够完成从供电、电路系统到信号输出等一系列任务的网络。然而,在现代电子产品中,内部电路板的空间往往非常有限。如果按常规方式堆叠,那么印刷电路板(PCB)已容纳不下所有的必需元件,因此三维电路载板便成为优先解决方案。而很多设备生命周期的缩短再次提出了新的挑战: Almost all modern devices require a circuit board to integrate one or more chips, as well as additional required electronics. As a result, a network capable of fulfilling a series of tasks, from power supply, circuit system to signal output, was created. However, in modern electronic products, the internal circuit board space is often very limited. If stacked in the conventional manner, the printed circuit board (PCB) does not contain all of the necessary components, so a three-dimensional circuit board becomes a priority solution. The shortening of the life cycle of many devices again poses new challenges: