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综述了电子电路表面组装技术 (SMT)再流焊焊接工艺仿真与预测研究的必要性、重要意义及其研究现状 ,并对其应用现状及其发展趋势进行了评述。
The necessity, importance and research status of simulation and prediction of surface mount technology (SMT) reflow soldering are reviewed. The current situation and development trend are also reviewed.