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本文介绍了一种制作固体热释电红外探测器列阵的技术,并且着重讨论了与一般的热释电探测器列阵,特别是与固体热释电探测器列阵相关的四个主要问题:(1)灵敏度,(2)空间分辩率,(3)衬底的热负载,(4)工艺上切实可行的制作技术。可以证明,在一个分立的寄存器中将高斩光率和电子信号积分组合起来,就能够得到很好的灵敏度和高的空间分辩率。在分辨率是100线对/厘米(象元线度为50微米)的情况下,最佳斩光率可以高到足以使衬底只有很小的(或者没有)热负载效应。所以,混合式探测器可以使用简便的倒装(Flip-chip)联接或者导线联接工艺制作。以最近报道的CCD多路传输电子学性能为基础所做的计算表明,当等效帧频是15赫、空间分辩率是100线对/厘米和有电子信号积分时,可得到的最小分辩温度是0.25℃。在同样空间分辩率的条件下,这一性能比目前最新工艺水平的热释电摄象管的性能要好10倍左右。我们制作了一种有自扫描场效应晶体管(FET)多路传输电子线路的32元线性探测器列阵(单元线度为4密耳×3.5密耳),报道了初次制得的列阵的性能。上述技术已获得专利。
This article presents a technique for fabricating solid pyroelectric infrared detector arrays and focuses on four major issues associated with typical pyroelectric detector arrays, and in particular with solid pyroelectric detector arrays : (1) sensitivity, (2) spatial resolution, (3) thermal load on the substrate, and (4) practical fabrication techniques. It turns out that the combination of high chopping and electronic signal integration in a separate register gives good sensitivity and high spatial resolution. In the case of a resolution of 100 lines per centimeter (with a pixel pitch of 50 microns), the optimum chopping rate may be high enough to have a small (or no) thermal loading effect on the substrate. Therefore, hybrid detectors can be easily flip-flops (Flip-chip) connection or wire bonding process. Calculations based on the recently reported CCD multiplexing electronics show that the minimum resolution temperature available when the equivalent frame rate is 15 Hz and the spatial resolution is 100 lines per centimeter and there is integration of the electronic signal Is 0.25 ° C. In the same space-resolution conditions, this performance than the current state of the art pyroelectric tube performance is about 10 times better. We have fabricated a 32-element linear detector array with self-scanning field-effect transistor (FET) multiplexed electronics with cell densities of 4 mils by 3.5 mils reporting the performance. The above technology has been patented.