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为解决微光成像器件管体熔化铟锡合金层出现的气泡、熔层断裂,流散不均匀等质量问题,利用俄歇谱仪和CS-344碳硫联合测定仪对焊料材料杂质进行了分析研究。结果表明,焊料体内吸收的杂质主要是H2,O2,C,S元素,它们是焊料熔层气泡产生的主要原因。焊料基材表面氧化,污染会造成焊料熔层断裂,通过改进工艺,研究了一种管体高效焊料熔化工艺,保证了焊料熔化质量,研制成功了高性能二代近贴微光管和紫外阴极像增强器。
In order to solve the quality problems of blister, melt fracture and uneven flow in the indium-tin alloy tube of the micro-imaging device, the impurity of the solder material was analyzed by Auger spectrometer and CS-344 carbon-sulfur analyzer . The results show that the impurities absorbed by the solder are mainly H2, O2, C and S elements, which are the main reasons for the formation of bubbles in the solder melt layer. The surface of the solder substrate is oxidized and contaminated, which leads to the fracture of the solder melt layer. By improving the process, a highly efficient solder melting process of the tube body is studied to ensure the melting quality of the solder. A high performance second- Like enhancer.