论文部分内容阅读
用多种微结构分析方法及高温电阻方法研究了原位法制备的Cu-20％Nb(纤维)/Sn复合材料在350～450℃低温热处理过程中Nb纤维(等效于惰性标记)向背离Cu-Sn合金方向迁移并富集的机理。结果表明:Nb纤维的迁移和热处理过程中Cu/Sn互扩散形成ε相时的体积膨胀有关。处于高度拉伸应变状态的Nb纤维在热处理过程中因应力释放而弯折或卷曲则为Nb纤维的移动提供了主要驱动力,使得其富集程度与温度有关。
A variety of microstructure analysis methods and high temperature resistance method were used to study the in-situ preparation of Cu-20% Nb (fiber) / Sn composite at 350 ~ 450 ℃ low temperature heat treatment of Nb fiber (equivalent to inert labeling) Cu-Sn alloy direction migration and enrichment mechanism. The results show that the migration of Nb fibers is related to the volumetric expansion of Nb fibers during the formation of ε phase during the interconduct diffusion of Cu / Sn during the heat treatment. The bending or curling of Nb fibers at high tensile strain due to stress release during heat treatment provides a major driving force for the movement of Nb fibers, making their degree of enrichment temperature dependent.