随着CMOS工艺技术的进步,集成化、小型化成为电子器件的发展趋势。提出了一种基于CMOS工艺的中频数字接收机片上系统(SoC)方案,实现了将射频接收前端、A/D转换器(ADC)、数字下变频器(DDC)和数字基带处理器集成在一个芯片上。该芯片采用0.18μm CMOS工艺,芯片面积为(7×8)mm~2。在0.5~4GHz范围内完成了芯片测试。测试结果表明,SoC芯片射频接收前端的镜像抑制比为46.3dB,系统噪声为9.4dB,增益控制范围为54.4dB,满足系统的指标要求。该芯片在小型化、集成化、高可靠性电子系统中有广泛的应用前景。 With the progress of CMOS technology, integration and miniaturization have become the development trend of electronic devices. A SoC solution based on CMOS technology for IF digital receiver is presented. It integrates RF receive front-end, A / D converter (ADC), digital down converter (DDC) and digital baseband processor in one Chip. The chip uses 0.18μm CMOS technology, the chip area (7 × 8) mm ~ 2. In the range of 0.5 ~ 4GHz to complete the chip test. The test results show that the SoC chip RF front-end image rejection ratio of 46.3dB, the system noise of 9.4dB, gain control range of 54.4dB, to meet the system’s target requirements. The chip in a small, integrated, high reliability electronic system has a wide range of applications.