在集成电路生产过程中,我们发现了一个不引人注意,但又严重地影响着产品成品率的问题,即过量的硅-铝合金化能使集成电路性能下降.我们曾观察到,在合金化前选出一批电路中性能良好的调试管芯,经过不适当的条件合金化,部份或成批的管芯特性变坏,如图1示.而将Al和SiO_2层全部去除,重测这批管芯,特性又恢复正常.很显然,问题在Al与 In the production of integrated circuits, we found an unobtrusive but serious impact on the yield of the product, that excessive silicon-aluminum alloy can make the integrated circuit performance degradation.We have observed that the alloy Select a group of good performance before debugging a number of debug die, after the inappropriate conditions of alloying, some or batches of die deterioration, as shown in Figure 1. The Al and SiO 2 layer all removed, heavy Test these die, the characteristics returned to normal. Obviously, the problem with Al and