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近日,市场研究公司Gartner指出,全球半导体资产投资、硅片加工设备投资、封装和装配设备投资在2003年呈现增长趋势。其中半导体资产投资2003年预计增长7.2%,从去年的278亿美元增长到300亿美元;硅片设备投资预计总共为175亿美元,比去年的161亿美元增长了8.4%;封装和装配设备投资预计将增长21.4%,从去年的23亿美元增长到28亿美元。
Recently, Gartner, a market research firm, pointed out that global investment in semiconductor assets, wafer processing equipment investment, packaging and assembly equipment increased in 2003. Semiconductor investment in which is expected to grow by 7.2% in 2003 from last year’s 27.8 billion US dollars to 30 billion US dollars; silicon equipment investment is expected to total 17.5 billion US dollars, 16.1 billion US dollars last year, an increase of 8.4%; packaging and assembly equipment investment It is projected to grow by 21.4% from 2.8 billion U.S. dollars last year to 2.8 billion U.S. dollars.