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通过金相、扫描电镜分析和物理性能测试等手段，对化学镀铜的石墨粉与铜粉混合制备成的复合材料的组织、性能、工艺进行了研究。结果表明，在平均粒度４—６μｍ石墨表面能均匀地涂覆金属铜，并且在压制压力、烧结温度合适的条件下，复合材料的组织均匀，致密性好，石墨在基体中弥散分布，金属铜形成细小的三维网状搭接。这种组织形态使材料的导电性及强度明显提高，特别是电阻率较国内成分相近的市售商品牌号降低４５％。
The microstructure, properties and process of composites prepared by mixing graphite powder and copper powder with electroless copper plating were studied by means of metallography, SEM and physical property test. The results show that the average particle size of 4-6μm graphite surface can be uniformly coated with copper, and the pressure in the sintering temperature under the appropriate conditions, the composite microstructure, compact, graphite dispersed in the matrix, the copper The formation of small three-dimensional mesh lap. This form of organization significantly improved the electrical conductivity and strength of the material, and in particular, the commercial grades with similar resistivities than the domestic ingredients have been reduced by 45%.