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Abstract:With the development of lead-free solder alloys,the investiagtion focusing on the relibility of lead-free solders are essential.Since the reliability database of lead-free solder joints needs to be further supplied,the creep behavior of SnAgCu soldered joints on Quad Flat Package (QFP) devices under thermo cycling load are studied in this paper,compared to conventional SnPb solder,by finite element simulation based on Garofalo-Arrhenius creep model.Meanwhile,the mechanical properties of SnAgCu and SnPb soldered joints in the pitches of QFP devices are also carried out by means of tensile test.The results indicate that the values of strain and stress of SnAgCu soldered joints were all smaller than those of SnPb under thermal cycling,and the tensile strength of the joints soldered with SnAgCu solder was higher than that of SnPb,which means the reliability of the joints soldered with SnAgCu solder is better than SnPb soldered joints.As the fracture surface morphology of the soldered joints compared,SnAgCu soldered joint presented ductile fracture,while the fracture mechanism of SnPb solder joints displayed both brittle and ductile fracture.Above all,the experimental results is in accord with that of simulation,which will provide guidance for reliability study and application of lead-free solders.