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本文在扩散焊接过程界面孔洞收缩数值分析的基础上，进一步对界面动态再结晶和晶粒长大，以及位错攀移和蒸发－凝结机理对扩散焊接的作用进行了分析，结果表明，界面动态再结晶对扩散焊接有较大影响，而位错攀移和蒸发－凝结机理的影响不明显。利用该模型确定的工艺参数，在ＴＣ４和ＴＣ１２的扩散焊接实验和产品研制中获得了令人满意的结果，减少了试验次数，提高了成品合格率。
Based on the numerical analysis of the hole shrinkage in the interface during diffusion welding, the effects of dynamic recrystallization and grain growth, the mechanism of dislocation climbing and evaporation-condensation on the diffusion welding are analyzed. The results show that the interface dynamics Recrystallization has a great influence on diffusion welding, but the effect of dislocation climbing and evaporation-condensation mechanism is not obvious. The process parameters determined by the model obtained satisfactory results in the diffusion welding experiments and product development of TC4 and TC12, reducing the number of tests and improving the yield of finished products.