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简要叙述了激光增强电镀的机理并介绍了激光有极电镀铜的实验装置。实验中采用CuSO_4水溶液为电解液,使用预先镀有镍薄膜的玻璃基片作为阴极、铂片作为阳极。两电极间施加2V左右的直流电压。当功率为1W的氩离子激光束经光学系统会聚后穿过电解液聚焦在阴极上时,实验获得了直径约为几十微米、厚度为几微米的金属铜镀点。镀层沉积速率为0.1～1μm/s。测量表明由于激光引起的电镀增强率高达10~3以上。
The mechanism of laser enhanced plating is briefly described and the experimental apparatus for laser copper plating is introduced. In the experiment, a CuSO4 aqueous solution was used as the electrolyte, a glass substrate pre-plated with a nickel thin film was used as a cathode, and a platinum plate was used as an anode. Between the two electrodes is applied about 2V DC voltage. When the power of 1W argon ion laser beam converges through the optical system through the electrolyte focused on the cathode, experimentally obtained a diameter of about tens of microns, the thickness of a few microns of copper plating. Plating deposition rate of 0.1 ~ 1μm / s. Measurement shows that due to laser-induced plating enhancement rate as high as 10 to 3.