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电子设备的封装结构多采用层状排布,封装方式多采用焊接工艺,因此封装体中的电子元件失效形式大多是由于各层封装材料热膨胀性能不匹配,导致开、断开关时焊接点脱落或开裂,进而导致硅芯片工作热量不能通过散热基板扩散至电子设备之外,芯片因工作温度过高而失效。运用ANSYS热分析软件对电子封装结构进行热应力分析发现,温度变化对焊料的脱落、开裂造成显著影响。根据热分析结果,提出有关焊料厚度及封装材料性能的改进意见,这样既节约实验成本,又能有效缩短研究电子封装可靠性及电子设备使用寿命的时间。
Electronic devices are mostly layered structure packaging structure, the use of more welding methods package, so the failure of electronic components in the package are mostly due to the thermal expansion of the packaging materials do not match, resulting in open and shut off when the solder joints off or Cracking, and thus lead to the work of the silicon chip heat can not be spread through the cooling substrate to the electronic device, the chip failure due to high operating temperature. The thermal stress analysis of electronic package using ANSYS thermal analysis software found that the temperature change has a significant impact on the solder off and cracking. According to the results of the thermal analysis, some suggestions on improving the thickness of the solder and the performance of the packaging material are proposed. This not only saves the experimental cost but also shortens the time for studying the reliability of the electronic package and the service life of the electronic device.