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三极管玻璃钝化成功的关键之一是采用双槽结构(也叫沟槽结构).在这种结构中,每一个芯片拥有一个环绕芯片的独立沟槽,这样两芯片之间有两个沟槽,双槽结构即由此得名.作为钝化的玻璃仅淀积在沟槽上.由于沟槽较窄(90～200μm),所以可使玻璃和硅之间的热失配影响减至最小,从而限制了玻璃上裂纹的产生.划片是通过双槽间的硅屏障进行的,而不是通过玻璃进行的,因此芯片分离时不会损伤玻璃.划片方便,工艺兼容性好.
One of the keys to the successful passivation of a transistor is its dual-trench structure, also known as a trench structure, in which each chip has a separate trench around the chip so that there are two trenches between the two chips , Hence the double-groove structure, hence its name.Passed glass is deposited only on the trenches.As the trenches are narrow (90-200 μm), the effect of thermal mismatch between glass and silicon can be minimized , Thus limiting the generation of cracks on the glass.Dialing through the double-cell silicon barrier, rather than through the glass, so the chip will not damage the glass separation.Sched easy, good process compatibility.