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采用Gleeble-1500D热模拟试验机,对Cu-Ni-Si-Cr合金在变形温度为600～800℃、应变速率为0.01～5 s-1条件下的动态再结晶行为以及组织转变进行了研究,分析了实验合金在高温变形时的流变应力和应变速率及变形温度之间的关系,并研究了在热压缩过程中组织的变化。结果表明:应变速率和变形温度的变化强烈地影响合金流变应力的大小,流变应力随变形温度升高而降低,随应变速率提高而增大,材料显微组织强烈受到变形温度的影响。
The dynamic recrystallization behavior and microstructure transformation of Cu-Ni-Si-Cr alloy at deformation temperature of 600 ~ 800 ℃ and strain rate of 0.01 ~ 5 s-1 were studied by Gleeble-1500D thermal simulation tester. The relationship between the flow stress, the strain rate and the deformation temperature of the experimental alloy at high temperature deformation was analyzed. The change of microstructure during hot compression was also studied. The results show that the strain rate and deformation temperature strongly influence the flow stress of the alloy. The flow stress decreases with the increase of deformation temperature and increases with the increase of strain rate. The microstructure of the material is strongly affected by the deformation temperature.