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向Cu-Ni-Si合金中添加少量的Fe、P,制备了Cu-Ni-Si-Fe-P合金。研究了热处理对Cu-1.7Ni-0.5Si-0.27Fe-0.03P合金显微组织演变、电导率和硬度的影响。结果表明,随着固溶温度升高,合金中树枝状的析出物逐渐溶解,在850℃×1h固溶处理后析出相充分固溶于基体中。合金硬度(HV)随着固溶温度升高而快速下降,最低达到107.39;电导率小幅下降,最低为12.75MS/m。经850℃×1h固溶处理+500℃×3h时效后,硬度(HV)达到208.10,电导率达到23.78MS/m,软化温度达到568.7℃。合金在时效初期先析出大颗粒的NiSiFeP等化合物,时效后分解成较小的FeP和NiSi化合物。
A small amount of Fe and P was added to the Cu-Ni-Si alloy to prepare a Cu-Ni-Si-Fe-P alloy. The effects of heat treatment on the microstructure evolution, conductivity and hardness of Cu-1.7Ni-0.5Si-0.27Fe-0.03P alloy were studied. The results show that as the solution temperature increases, the dendritic precipitates gradually dissolve in the alloy, and the precipitated phase is fully dissolved in the matrix after solution treatment at 850 ℃ for 1h. The hardness of alloy (HV) decreases rapidly with the increase of solution temperature, reaching a minimum value of 107.39. The conductivity decreases slightly with a minimum of 12.75 MS / m. After 850 ℃ × 1h solution treatment + 500 ℃ × 3h aging, the hardness (HV) reached 208.10, the conductivity reached 23.78MS / m and the softening temperature reached 568.7 ℃. Alloy early precipitated large particles of NiSiFeP and other compounds, after aging decomposition into smaller FeP and NiSi compounds.