【摘 要】
：
Electroless tin plating is a new process and also is the only wet deposition process instead of tin plating, which has many advantages, such as good dispers
【机 构】
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Research Center for Analysis and Measurement, Kunming University of Science and Technology,Kunming,
【出 处】
：
第五届国际湿法冶金学术会议(5th International Conference on Hydrometallurg
论文部分内容阅读
Electroless tin plating is a new process and also is the only wet deposition process instead of tin plating, which has many advantages, such as good dispersive ability of the bath, high productivity and convenient controlling, especially, the tin film on copper substrate has excellent soderability, antioxidant and corrosion resistance, so that the requirements of the electron parts and printed circuit board are much more and more with the rapid development of electron industry.At present, tin films are usually made out by plating method, about the report on electroless tin plating is every little at home and in abroad.
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