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在混合电路工艺领域中,被瓷钢衬底工艺(PSS)与普通的氧化铝衬底工艺的主要区别就在于现行厚膜膏剂的“产品成熟性”和衬底材料的稳定性(即:衬底与膏剂的相互作用的程度和影响印刷膜层的程度)。本文简单阐述了对这些因素以及另外一些因素进行定量分析的技术;同时对三家公司(Dupont,ESL,EMCA)提供的用于PSS的膏剂的性能与用于氧化铝的材料的性能进行了比较并给出了具体数据。重点在于各种差别对电路布局和制造方法的影响。
In the field of hybrid circuit technology, the main difference between PSS and conventional alumina substrate processes lies in the “product maturity” of existing thick film pastes and the stability of the substrate material (ie, the liner The extent of the interaction of the bottom with the paste and the extent of the printed film layer). This article briefly describes techniques for quantitatively analyzing these and other factors. At the same time, the performance of the paste for PSS provided by three companies (Dupont, ESL, EMCA) is compared with that of the material used for alumina Given the specific data. The emphasis is on the impact of various differences on circuit layout and manufacturing methodologies.