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一、前言波峰焊是一种以锡铅合金为焊料的自动焊接工艺,其特点是被焊母材(指引线和铜箔)不熔化,而靠熔融焊料填充其间并在焊接温度下发生相互扩散,生成合金层,从而达到永久性连接。图1为单面印制板引线焊点结构示意图。从图1不难看出,一个理想的焊点是由焊料、合金层和母材组成。可见焊点的机械强度主要取决于下面几个因素:
I. Introduction Wave soldering is an automatic soldering process using tin-lead alloy as a soldering material. The soldering process is characterized in that the base material to be welded (the leading wire and the copper foil) is not melted, but is filled by the molten soldering material and interdiffusion occurs at the soldering temperature , Generate alloy layer, so as to achieve a permanent connection. Figure 1 is a schematic view of single-sided PCB lead solder joints. It is easy to see from Figure 1 that an ideal solder joint consists of solder, alloy layer and base metal. Visible mechanical strength of solder joints depends mainly on the following factors: