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本文主要报导了剥离光刻工艺及其在半导体集成电路CMOS刻铝中的应用方法,工艺实验是在生产线上进行的,本文还报导了实验结果、CV测试及高温存贮情况。
This article mainly reports the stripping lithography process and its application in the semiconductor integrated circuit CMOS engraved aluminum. The process experiment is carried out on the production line. The article also reports the experimental results, CV test and high temperature storage.