美国国家标准与技术研究所(NIST)与IBM的研究人员开发了一种沟槽(trenching)技术,能被用以透过定向自组装(self-directed assembly)来打造元件。研究人员表示,金纳米粒子能像是铲雪机那样运作,在磷化铟(indium phosphide)或其他半导体材料层翻搅而过,形成纳米通道。这种技术可望被用来在所谓的实验室单晶片(lab-on-a-chip)元件上整合激光、感测器、波导(wave guides)与其他光学零组件,支援疾病诊断、筛选实验性材料与药物、DNA检验 Researchers at the National Institute of Standards and Technology (NIST) and IBM have developed a trenching technology that can be used to create components through directed self-directed assembly. Researchers say the gold nanoparticles work like a snow blade and stir at indium phosphide or other semiconductor layers to form nanochannels. This technique is expected to be used to integrate lasers, sensors, wave guides and other optical components on so-called lab-on-a-chip components to support disease diagnosis and screening experiments Sexual Materials and Drugs, DNA Testing