硅LSi用逐年在加工微细化方面取得进展，同时，在高集成化、高速化等高性能方面也相应进展迅速。但是，越是微细化，而热载流于效应就增大；这就增大了使可靠性劣化的因素。于是，在实用时便成了极大难题。本次开发了可解决上述问题、又可同时达到高可靠性、高速性的0．15μmCM Silicon LSi is making progress every year in terms of processing miniaturization, and at the same time, advances in high performance such as high integration and high speed are also being made. However, the more miniaturized, the more the effect of hot carrier flow increases; this increases the factor that degrades the reliability. So, in practical time has become a big problem. This development can solve the above problems, but also achieve high reliability, high speed 0.15μmCM