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采用真空电子束焊对Ti3Al与TC11合金进行连接,研究不同焊接电流时其焊接界面合金元素扩散及显微硬度。结果表明,焊接电流的大小对合金元素在焊接界面上的扩散规律影响很小,均在焊缝和两侧基体交界处存在较大浓度梯度,这是由于焊接结束冷却时产生了粗大的凝固组织和相变且未有充分的能量和时间进行扩散所造成的。无论所采用焊接电流的大小,沿整个试样其焊缝处的显微硬度值均最高;随着焊接电流的增大,TC11侧和焊缝区的显微硬度值基本上增大,而焊接电流的变化对Ti3Al侧显微硬度值影响的规律性不强。
Ti3Al and TC11 alloys were connected by vacuum electron beam welding to study the diffusion and microhardness of alloying elements in the welding interface with different welding current. The results show that the size of the welding current has little effect on the diffusion regularity of the alloying elements at the welding interface, and there is a large concentration gradient at the interface between the weld and the two sides of the substrate. This is due to the coarse solidified structure And phase change without sufficient energy and time to spread. Regardless of the size of the welding current used, the microhardness value of the weld along the entire sample is the highest. With the increase of the welding current, the microhardness of the TC11 side and the weld zone basically increases, The change of current has no regularity on the microhardness of Ti3Al.