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为了研究适合于缠绕成型的低粘度可电子束固化复合材料的耐热环氧树脂基体,研究了不同组成的电子束固化树脂体系的粘度与温度的关系、耐热性与辐射剂量的关系及浇注体的力学性能。研究表明,树脂EB-4在60℃时粘度为389 mPa.s,树脂辐射固化的最佳剂量为150 kGy,而且在150 kGy辐射固化的EB-1、EB-4的玻璃化转变温度Tg分别为212.96℃、214.77℃,EB-4树脂浇注体的拉伸强度可以达到52.7 MPa,拉伸弹性模量2.79 GPa,断裂延伸率为2.18%,是1种适用于室温或低温下缠绕成型的耐热电子束固化环氧树脂基复合材料树脂体系。
In order to study the heat-resistant epoxy resin matrix of low viscosity e-beam-curable composites suitable for winding and forming, the relationship between the viscosity and temperature of electron beam curable resin systems with different compositions, the relationship between heat resistance and radiation dose, Body mechanical properties. The results show that the resin EB-4 has a viscosity of 389 mPa.s at 60 ° C, an optimum radiation dose of 150 kGy for the resin and a glass transition temperature Tg of EB-1 and EB-4 at 150 kGy Of 212.96 ℃, 214.77 ℃, the tensile strength of EB-4 resin cast body can reach 52.7 MPa, tensile modulus of elasticity of 2.79 GPa, elongation at break of 2.18%, which is a suitable for room temperature or low temperature winding molding resistance Hot electron beam curing epoxy resin matrix composite resin system.