利用现有的CMOS工艺加工线,可以采用MEMS(微电子机械加工)技术,如利用铝悬桥微动作改变电容值控制射频传送的工作,来制作RF(射频)微开关器件。这种在晶圆片上制作的微开关含有可动的、易损的部分,需要考虑特殊的封装方法进行保护。比如,由于在晶圆片上做好微开关后,采用一般的晶圆片分割芯片的划片加工就可能损坏这种MEMS器件,这就使得要考虑圆片级封装,即在划成芯片之前,在晶圆片 Using existing CMOS process lines, MEMS (Micro Electro Mechanical Machining) technology, such as the use of an aluminum suspension bridge to change capacitance to control RF transmission, is used to make RF (radio frequency) micro-switching devices. This micro-switch made on the wafer contains a movable, fragile parts, need to consider the special packaging methods for protection. For example, wafer dicing can result in the possibility of damaging the MEMS device by using a conventional wafer dicing process after micro-switching on the wafer. This makes it necessary to consider the wafer-level packaging, that is, before being diced into chips, In the wafer