论文部分内容阅读
AMD(AMD)和富士通(Fujitsu)合资的闪存厂商Spansion LLC公司与Atheros Communications公司宣布开发出一种创新的封装解决方案,可以大大缩小目前蜂窝/无线局域网(WLAN)双模手机的尺寸。该封装解决方案将Atheros移动射频芯片(Radio-on-Chip for Mobile)802.11a/g和802.11g解决方
Spansion LLC and Atheros Communications, a joint venture between AMD (AMD) and Fujitsu, have announced an innovative packaging solution that will greatly reduce the size of current dual-mode cellular / wireless LAN (WLAN) phones. The solution encapsulates the Atheros Mobile Radio-on-Chip for Mobile 802.11a / g and 802.11g solutions