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本文分析了影响多层HDI板特性阻抗的其它因素,重点讨论了针对多层HDI板计算PCB带状线的特性阻抗及如何在设计中规避PCB加工所带来的负面影响。
This paper analyzes other factors that affect the characteristic impedance of multi-layer HDI boards, and focuses on calculating the characteristic impedance of PCB striplines for multi-layer HDI boards and how to avoid the negative effects of PCB processing in the design.