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统计过程控制(SPC)技术已广泛用于半导体器件生产,采用SPC技术可以提高半导体器件的质量和可靠性。利用控制图可以监控生产过程状态,对生产中出现的异常及时进行分析、改进,使半导体器件工艺的生产过程处于受控状态。介绍了SPC技术的基本概念和技术控制流程、常规控制图及其分类以及引用的国家标准。给出了目前的工序能力指数(Cp)的控制水平、工序能力指数和工艺成品率及不合格品率的对应关系,以及几种在常规控制图基础上扩展的适合半导体器件工艺的其他控制图技术,分析了国内某半导体器件生产线SPC技术的利用情况及存在的问题。
Statistical Process Control (SPC) technology has been widely used in the production of semiconductor devices and the use of SPC technology can improve the quality and reliability of semiconductor devices. The use of control charts can monitor the status of the production process, the production of anomalies in a timely manner to analyze, improve, so that the production process of semiconductor devices in a controlled state. Introduced the basic concepts of SPC technology and technical control processes, conventional control charts and their classification and reference of national standards. The current control level of process capability index (CP), the correspondence between process capability index and process yield and reject yield are given, and several other control charts suitable for semiconductor device processing based on conventional control charts Technology, analyzed the utilization situation and existing problems of SPC technology in a certain domestic semiconductor device production line.